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BGA Rework Station R5860 BGA Rework Station In Stock & Ready to Ship

BGA Rework Station R5860

MODEL / SKU: R5860
Direct Factory Quote Available
High performance optical alignment BGA rework station for TV motherboard and laptop repair.
What Is a BGA Rework Station? A BGA rework station is a professional workspace system technicians use to alter printed circuit boards with ball grid array (BGA) packaging and surface-mounted devices (SMD). These rework stations can also alter circuit boards with column grid array packaging, chip scale packages, quad flat packages, land grid arrays, and other SMD chips. Features of R5860: - Split-vision optical prism alignment camera for precise BGA chip placement. - 3 independent heating zones (Top Hot Air 1200W, Bottom Hot Air 1200W, Bottom IR Heater 2700W). - PLC Control with 7" HD Touch Screen and real-time temperature profiling. - Intelligent V-Groove PCB packet with 6-point support clamps for all motherboard shapes.

Technical Specifications Table

Operating Method
Hot Air Flow Based
Total Power
5100 Watt
Top Heater Power
1200 Watt
Bottom Heater Power
1200 Watt
IR Heater Power
2700 Watt
Top Heater Movement
Right/Left, Frontward/backward, Rotate freely
Operating Control
PLC Control With 7" HMI HD Touch Screen
Profiles
De Solder (Unmount), Solder (Mount), Lead Free & Leaded Balls
Positioning
V-Groove PCB Packet with 6 Points Supports & Universal Fixtures
Temperature Control
K-Type Closed Loop Sensor
Temperature Accuracy
± 2°C
PCB Size Compatibility
Max 410 x 370 mm, Min 22 x 22 mm
BGA Chip Size Compatibility
Max 80 x 80 mm, Min 2 x 2 mm

Package Accessories & Tool Kit

Nozzle Package
5 Nozzles included
Sensors
1 External Temperature Sensor Cable
Pick-Up Tool
1 Vacuum Suction Pen
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